Invention Grant
- Patent Title: Device housing and manufacturing method
- Patent Title (中): 设备外壳和制造方法
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Application No.: US13336012Application Date: 2011-12-23
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Publication No.: US08624113B2Publication Date: 2014-01-07
- Inventor: Po-Feng Ho
- Applicant: Po-Feng Ho
- Applicant Address: HK Kowloon
- Assignee: FIH (Hong Kong) Limited
- Current Assignee: FIH (Hong Kong) Limited
- Current Assignee Address: HK Kowloon
- Agency: Altis Law Group, Inc.
- Priority: CN201110232307 20110815
- Main IPC: H05K5/00
- IPC: H05K5/00

Abstract:
A housing includes a transparent panel and a housing body. The housing body includes a main body and a flange portion extending from the main body. The filler is formed between the transparent panel and the housing body. The filler includes a first connecting portion, a second connecting portion, and a support portion integrally formed together, the first connecting portion connecting the transparent panel to the flange portion, the support portion supporting the transparent panel, and the second connecting portion connected to the housing body.
Public/Granted literature
- US20130043054A1 DEVICE HOUSING AND MANUFACTURING METHOD Public/Granted day:2013-02-21
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