Invention Grant
- Patent Title: Light-emitting diodes on concave texture substrate
- Patent Title (中): 凹面纹理基板上的发光二极管
-
Application No.: US13358327Application Date: 2012-01-25
-
Publication No.: US08629465B2Publication Date: 2014-01-14
- Inventor: Chen-Hua Yu , Hung-Ta Lin , Wen-Chih Chiou , Ding-Yuan Chen , Chia-Lin Yu
- Applicant: Chen-Hua Yu , Hung-Ta Lin , Wen-Chih Chiou , Ding-Yuan Chen , Chia-Lin Yu
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L33/08
- IPC: H01L33/08

Abstract:
A semiconductor device having light-emitting diodes (LEDs) formed on a concave textured substrate is provided. A substrate is patterned and etched to form recesses. A separation layer is formed along the bottom of the recesses. An LED structure is formed along the sidewalls and, optionally, along the surface of the substrate between adjacent recesses. In these embodiments, the surface area of the LED structure is increased as compared to a planar surface. In another embodiment, the LED structure is formed within the recesses such that the bottom contact layer is non-conformal to the topology of the recesses. In these embodiments, the recesses in a silicon substrate result in a cubic structure in the bottom contact layer, such as an n-GaN layer, which has a non-polar characteristic and exhibits higher external quantum efficiency.
Public/Granted literature
- US20120119236A1 Light-Emitting Diodes on Concave Texture Substrate Public/Granted day:2012-05-17
Information query
IPC分类: