Invention Grant
- Patent Title: Decomposing integrated circuit layout
- Patent Title (中): 分解集成电路布局
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Application No.: US12702591Application Date: 2010-02-09
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Publication No.: US08631379B2Publication Date: 2014-01-14
- Inventor: Pi-Tsung Chen , Ming-Hui Chih , Ken-Hsien Hsieh , Wei-Long Wang , Wen-Chun Huang , Ru-Gun Liu , Tsai-Sheng Gau , Wen-Ju Yang , Gwan Sin Chang , Yung-Sung Yen
- Applicant: Pi-Tsung Chen , Ming-Hui Chih , Ken-Hsien Hsieh , Wei-Long Wang , Wen-Chun Huang , Ru-Gun Liu , Tsai-Sheng Gau , Wen-Ju Yang , Gwan Sin Chang , Yung-Sung Yen
- Applicant Address: TW
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW
- Agency: Lowe Hauptman & Ham, LLP
- Main IPC: G06F17/50
- IPC: G06F17/50

Abstract:
Various embodiments of the invention provide techniques to ensure a layout for an integrated circuit is split-able. In a method embodiment, a layout is generated in a customer site having a layout library as inputs wherein the library provides exemplary layouts that have been verified to be spit-able and that can be used and layouts that can cause conflicts to avoid. A real-time odd cycle checker is also provided in which the checker identifies in real time conflict areas and odd cycles as they arise during layout generation. To reduce memory usage layouts of various devices may be separated so that each individual layout or a small number of layouts, rather than a large layout for the whole application circuit, can be checked against conflicts. Once the layout is ready at the customer site, it is sent to the foundry site to be decomposed into two masks and taped-out. Other embodiments are also disclosed.
Public/Granted literature
- US20110197168A1 DECOMPOSING INTEGRATED CIRCUIT LAYOUT Public/Granted day:2011-08-11
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