Invention Grant
- Patent Title: Circuit board with high-density circuit patterns
- Patent Title (中): 电路板采用高密度电路图案
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Application No.: US13354438Application Date: 2012-01-20
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Publication No.: US08633392B2Publication Date: 2014-01-21
- Inventor: Shuhichi Okabe , Myung-Sam Kang , Jung-Hyun Park , Hoe-Ku Jung , Jeong-Woo Park , Ji-Eun Kim
- Applicant: Shuhichi Okabe , Myung-Sam Kang , Jung-Hyun Park , Hoe-Ku Jung , Jeong-Woo Park , Ji-Eun Kim
- Applicant Address: KR Suwon
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon
- Priority: KR10-2006-0104203 20061025
- Main IPC: H05K1/02
- IPC: H05K1/02
Abstract:
A circuit board including: an insulator having a trench; a first circuit pattern formed to bury a portion of the trench; and a second circuit pattern formed on a surface of the insulator having the trench formed therein.
Public/Granted literature
- US20120111607A1 CIRCUIT BOARD WITH HIGH-DENSITY CIRCUIT PATTERNS Public/Granted day:2012-05-10
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