发明授权
- 专利标题： Semiconductor package with mechanical fuse
- 专利标题（中）： 半导体封装带机械保险丝
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申请号： US13537573申请日： 2012-06-29
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公开(公告)号： US08633551B1公开(公告)日： 2014-01-21
- 发明人: Weng Hong Teh , Kevin L. Lin , Feras Eid , Qing Ma
- 申请人： Weng Hong Teh , Kevin L. Lin , Feras Eid , Qing Ma
- 申请人地址： US CA Santa Clara
- 专利权人： Intel Corporation
- 当前专利权人： Intel Corporation
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Blakely, Sokoloff, Taylor & Zafman LLP
- 主分类号： H01L27/14
- IPC分类号： H01L27/14
摘要：
A semiconductor package having a mechanical fuse therein and methods to form a semiconductor package having a mechanical fuse therein are described. For example, a semiconductor structure includes a semiconductor package. A semiconductor die is housed in the semiconductor package. A microelectromechanical system (MEMS) device is housed in the semiconductor package. The MEMS device has a suspended portion. A mechanical fuse is housed in the semiconductor package and either coupled to, or decoupled from, the suspended portion of the MEMS device.
公开/授权文献
- US20140002178A1 SEMICONDUCTOR PACKAGE WITH MECHANICAL FUSE 公开/授权日：2014-01-02
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