发明授权
- 专利标题: High explosive fills for MEMS devices
- 专利标题(中): 用于MEMS器件的高爆炸性填充
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申请号: US12980571申请日: 2010-12-29
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公开(公告)号: US08636861B1公开(公告)日: 2014-01-28
- 发明人: Daniel Stec, III , Amy Wilson , Brian E. Fuchs , Neha Mehta , Paula Cook
- 申请人: Daniel Stec, III , Amy Wilson , Brian E. Fuchs , Neha Mehta , Paula Cook
- 申请人地址: US DC Washington
- 专利权人: The United States of America as represented by the Secretary of the Army
- 当前专利权人: The United States of America as represented by the Secretary of the Army
- 当前专利权人地址: US DC Washington
- 代理商 Henry S. Goldfine
- 主分类号: C06B25/34
- IPC分类号: C06B25/34
摘要:
Secondary crystalline high explosives are disclosed which are suitable for filling very small volume loading holes in micro-electric initiators for micro-electro-mechanical mechanisms (MEMS), used as safe and arm (S&A) devices. The explosives are prepared by adding the such a high explosive to an aqueous first volatile mobile phase, adding such a high explosive to a non-aqueous second volatile mobile phase, mixing the first and second volatile mobile phases and then loading the combined phases into the MEMS device and allowing the aqueous and non-aqueous solvents to evaporate depositing the high explosive. Enhanced adhesion between the deposited high explosive and enhanced rheological properties can be obtained by adding a polymeric binder to both mobile phases.