发明授权
- 专利标题: Metal gate structures and methods for forming thereof
- 专利标题(中): 金属门结构及其形成方法
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申请号: US13116794申请日: 2011-05-26
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公开(公告)号: US08637390B2公开(公告)日: 2014-01-28
- 发明人: Seshadri Ganguli , Sang Ho Yu , Sang-Hyeob Lee , Hyoung-Chan Ha , Wei Ti Lee , Hoon Kim , Srinivas Gandikota , Yu Lei , Kevin Moraes , Xianmin Tang
- 申请人: Seshadri Ganguli , Sang Ho Yu , Sang-Hyeob Lee , Hyoung-Chan Ha , Wei Ti Lee , Hoon Kim , Srinivas Gandikota , Yu Lei , Kevin Moraes , Xianmin Tang
- 申请人地址: US CA Santa Clara
- 专利权人: Applied Materials, Inc.
- 当前专利权人: Applied Materials, Inc.
- 当前专利权人地址: US CA Santa Clara
- 代理机构: Moser Taboada
- 代理商 Alan Taboada
- 主分类号: H01L21/4763
- IPC分类号: H01L21/4763
摘要:
Metal gate structures and methods for forming thereof are provided herein. In some embodiments, a method for forming a metal gate structure on a substrate having a feature formed in a high k dielectric layer may include depositing a first layer within the feature atop the dielectric layer; depositing a second layer comprising cobalt or nickel within the feature atop the first layer; and depositing a third layer comprising a metal within the feature atop the second layer to fill the feature, wherein at least one of the first or second layers forms a wetting layer to form a nucleation layer for a subsequently deposited layer, wherein one of the first, second, or third layers forms a work function layer, and wherein the third layer forms a gate electrode.
公开/授权文献
- US20110298062A1 METAL GATE STRUCTURES AND METHODS FOR FORMING THEREOF 公开/授权日:2011-12-08
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