发明授权
- 专利标题： Device housing and method for making the same
- 专利标题（中）： 设备外壳及其制作方法
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申请号： US13087512申请日： 2011-04-15
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公开(公告)号： US08637862B2公开(公告)日： 2014-01-28
- 发明人: Hsin-Pei Chang , Wen-Rong Chen , Huann-Wu Chiang , Cheng-Shi Chen , Ying-Ying Wang
- 申请人： Hsin-Pei Chang , Wen-Rong Chen , Huann-Wu Chiang , Cheng-Shi Chen , Ying-Ying Wang
- 申请人地址： CN Shenzhen TW New Taipei
- 专利权人： Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd,Hon Hai Precision Industry Co., Ltd.
- 当前专利权人： Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd,Hon Hai Precision Industry Co., Ltd.
- 当前专利权人地址： CN Shenzhen TW New Taipei
- 代理机构： Altis Law Group, Inc.
- 优先权： CN201010232894 20100721
- 主分类号： H01L29/10
- IPC分类号： H01L29/10
摘要：
A device housing is provided. The device housing includes a substrate, a silicon dioxide film formed on the substrate, and a zinc oxide film formed on the silicon dioxide film. The silicon dioxide film has micrometer sized structures. The zinc oxide film has nanometer sized structures. A method for making the device housing is also described there.
公开/授权文献
- US20120018340A1 DEVICE HOUSING AND METHOD FOR MAKING THE SAME 公开/授权日：2012-01-26
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