发明授权
- 专利标题: Semiconductor device and a method of manufacturing the same and a mounting structure of a semiconductor device
- 专利标题(中): 半导体装置及其制造方法以及半导体装置的安装结构
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申请号: US13357076申请日: 2012-01-24
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公开(公告)号: US08637965B2公开(公告)日: 2014-01-28
- 发明人: Yoshihiko Shimanuki
- 申请人: Yoshihiko Shimanuki
- 申请人地址: JP Kanagawa JP Yonezawa
- 专利权人: Renesas Electronics Corporation,Hitachi Yonezawa Electronics Co., Ltd
- 当前专利权人: Renesas Electronics Corporation,Hitachi Yonezawa Electronics Co., Ltd
- 当前专利权人地址: JP Kanagawa JP Yonezawa
- 代理机构: Mattingly & Malur, PC
- 优先权: JP11-184739 19990630; JP2000-105251 20000406
- 主分类号: H01L23/495
- IPC分类号: H01L23/495
摘要:
The semiconductor device includes a tab including a chip supporting surface, and a back surface opposite to the chip supporting surface; a plurality of suspension leads supporting the tab; a plurality of leads arranged between the suspension leads; a semiconductor chip mounted on the chip supporting surface of the tab, the semiconductor chip including a main surface, a plurality of pads formed on the main surface, and a rear surface opposite to the main surface; a seal portion sealing the semiconductor chip such that a part of each of the leads is exposed from the seal portion; and a Pb-free solder formed on the part of each of the leads. A part of the rear surface of the semiconductor chip is contacted with the seal portion.