发明授权
- 专利标题： Micromechanical method and corresponding assembly for bonding semiconductor substrates and correspondingly bonded semiconductor chip
- 专利标题（中）： 微机械方法和相应的组装，用于接合半导体衬底和相应的键合半导体芯片
-
申请号： US13509163申请日： 2010-09-23
-
公开(公告)号： US08638000B2公开(公告)日： 2014-01-28
- 发明人: Achim Trautmann , Ralf Reichenbach
- 申请人： Achim Trautmann , Ralf Reichenbach
- 申请人地址： DE Stuttgart
- 专利权人： Robert Bosch GmbH
- 当前专利权人： Robert Bosch GmbH
- 当前专利权人地址： DE Stuttgart
- 代理机构： Maginot, Moore & Beck
- 优先权： DE102009046687 20091113
- 国际申请： PCT/EP2010/064009 WO 20100923
- 国际公布： WO2011/057850 WO 20110519
- 主分类号： H01L23/48
- IPC分类号： H01L23/48
摘要：
A micromechanical assembly for bonding semiconductor substrates includes a semiconductor substrate having a chip pattern having a plurality of semiconductor chips, each having a functional region and an edge region surrounding the functional region. There is a bonding frame made of a bonding alloy made from at least two alloy components in the edge region, spaced apart from the functional region. Within the part of the edge region surrounding the bonding frame between the bonding frame and the functional region, there is at least one stop frame made of at least one of the alloy components, which is configured such that when a melt of the bond alloy contacts the stop frame during bonding, the bonding alloy solidifies.
公开/授权文献
信息查询
IPC分类:
