发明授权
US08639067B2 Fabrication method of optical wiring board and optical printed circuit board 失效
光接线板和光电印刷电路板的制作方法

  • 专利标题: Fabrication method of optical wiring board and optical printed circuit board
  • 专利标题(中): 光接线板和光电印刷电路板的制作方法
  • 申请号: US12866180
    申请日: 2009-01-14
  • 公开(公告)号: US08639067B2
    公开(公告)日: 2014-01-28
  • 发明人: Yasunobu Matsuoka
  • 申请人: Yasunobu Matsuoka
  • 申请人地址: JP Tokyo
  • 专利权人: Hitachi Chemical Company, Ltd.
  • 当前专利权人: Hitachi Chemical Company, Ltd.
  • 当前专利权人地址: JP Tokyo
  • 代理机构: Crowell & Moring LLP
  • 优先权: JP2008-028652 20080208
  • 国际申请: PCT/JP2009/000103 WO 20090114
  • 国际公布: WO2009/098834 WO 20090813
  • 主分类号: G02B6/12
  • IPC分类号: G02B6/12
Fabrication method of optical wiring board and optical printed circuit board
摘要:
The fabrication of an optical wiring board is performed in the following manner: A core member 13 for a mirror 22 is pattern-formed on a clad layer 11, and simultaneously, using the core member 13, each alignment mark pattern 14 is formed at any position on the clad layer 11. Further, with positioning in reference to each alignment mark 14, the core pattern 13 is subjected to physical cutting to form a bevel part and a concave part 23. Then, a metallic reflective film 18 is coated on the surface of the bevel part. Thereafter, with positioning in reference to each alignment mark 14, an optical wiring core pattern 20 is formed on the clad layer 11 adjacently to the mirror 22.
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