发明授权
- 专利标题: Multi-electrode implantable systems and assemblies therefor
- 专利标题(中): 多电极植入系统及其组件
-
申请号: US13962987申请日: 2013-08-09
-
公开(公告)号: US08639341B2公开(公告)日: 2014-01-28
- 发明人: John Louis Sommer , Joseph Michael D'Sa , Joyce K Yamamoto , Brad C Tischendorf , James D Reinke , Andrew J Thom , Thomas P Miltich , William John Taylor , Kenneth C Gardeski , Larry Earl Tyler , Jeffrey O York , Gordon O Munns
- 申请人: Medtronic, Inc.
- 申请人地址: US MN Minneapolis
- 专利权人: Medtronic, Inc.
- 当前专利权人: Medtronic, Inc.
- 当前专利权人地址: US MN Minneapolis
- 代理商 Reed A. Duthler
- 优先权: WOPCT/US2011/034455 20110429
- 主分类号: A61N1/362
- IPC分类号: A61N1/362
摘要:
Hermetically sealed assemblies, for example, that include IC chips, are configured for incorporation within a connector terminal of an implantable medical electrical lead, preferably within a contact member of the terminal. An assembly may include two feedthrough subassemblies, welded to either end of the contact member, to form an hermetic capsule, in which an IC chip is enclosed, and a tubular member, which allows a lumen to extend therethrough, along a length of the terminal. A multi-electrode lead may include multiplexer circuitry, preferably a switch matrix element and a communications, control and power supply element that are electrically coupled to the contact member and to another contact member of the terminal. Each pair of switch matrix switches allows for any two of the electrodes to be selected, in order to deliver a stimulation vector, via stimulation pulses from a device/pulse generator, to which the connector terminal is connected.
公开/授权文献
信息查询
IPC分类: