发明授权
- 专利标题: Active device array substrate
- 专利标题(中): 有源器件阵列衬底
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申请号: US13570266申请日: 2012-08-09
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公开(公告)号: US08643017B2公开(公告)日: 2014-02-04
- 发明人: Chu-Yu Liu , Ming-Hung Shih , Chou-Chin Wu , I-Chun Chen
- 申请人: Chu-Yu Liu , Ming-Hung Shih , Chou-Chin Wu , I-Chun Chen
- 申请人地址: TW Hsinchu
- 专利权人: Au Optronics Corporation
- 当前专利权人: Au Optronics Corporation
- 当前专利权人地址: TW Hsinchu
- 代理机构: Jianq Chyun IP Office
- 主分类号: H01L31/00
- IPC分类号: H01L31/00
摘要:
An active device array substrate including a first patterned conductive layer, a dielectric layer, a second patterned conductive layer, a passivation layer and pixel electrodes is provided. The first patterned conductive layer includes scan lines, common lines, gates and strip floating shielding patterns. The dielectric layer covering the first patterned conductive layer has first contact holes which expose a portion of the common lines, respectively. The second patterned conductive layer includes data lines, sources, drains and strip capacitance electrodes. Each strip capacitance electrode is electrically connected to one of the common lines through one of the first contact holes. A gap is formed between each data line and one strip capacitance electrode, and the strip floating shielding patterns are disposed under the data lines, the gap and the strip capacitance electrodes. Each pixel electrode is electrically connected to one of the drains through one of the second contact holes.
公开/授权文献
- US20120299004A1 ACTIVE DEVICE ARRAY SUBSTRATE 公开/授权日:2012-11-29