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US08643115B2 Structure and method of Tinv scaling for high κ metal gate technology
失效
用于高kappa金属栅极技术的Tinv缩放的结构和方法
- 专利标题: Structure and method of Tinv scaling for high κ metal gate technology
- 专利标题(中): 用于高kappa金属栅极技术的Tinv缩放的结构和方法
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申请号: US13006642申请日: 2011-01-14
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公开(公告)号: US08643115B2公开(公告)日: 2014-02-04
- 发明人: Michael P. Chudzik , Dechao Guo , Siddarth A. Krishnan , Unoh Kwon , Carl J. Radens , Shahab Siddiqui
- 申请人: Michael P. Chudzik , Dechao Guo , Siddarth A. Krishnan , Unoh Kwon , Carl J. Radens , Shahab Siddiqui
- 申请人地址: US NY Armonk
- 专利权人: International Business Machines Corporation
- 当前专利权人: International Business Machines Corporation
- 当前专利权人地址: US NY Armonk
- 代理机构: Scully, Scott, Murphy & Presser, P.C.
- 代理商 Joseph P. Abate, Esq.
- 主分类号: H01L27/092
- IPC分类号: H01L27/092
摘要:
A complementary metal oxide semiconductor (CMOS) structure including a scaled n-channel field effect transistor (nFET) and a scaled p-channel field transistor (pFET) which do not exhibit an increased threshold voltage and reduced mobility during operation is provided Such a structure is provided by forming a plasma nitrided, nFET threshold voltage adjusted high k gate dielectric layer portion within an nFET gate stack, and forming at least a pFET threshold voltage adjusted high k gate dielectric layer portion within a pFET gate stack. In some embodiments, the pFET threshold voltage adjusted high k gate dielectric layer portion in the pFET gate stack is also plasma nitrided. The plasma nitrided, nFET threshold voltage adjusted high k gate dielectric layer portion includes up to 15 atomic % N2 and an nFET threshold voltage adjusted species located therein, while the plasma nitrided, pFET threshold voltage adjusted high k gate dielectric layer portion includes up to 15 atomic % N2 and a pFET threshold voltage adjusted species located therein.
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