发明授权
- 专利标题： Lead frame with grooved lead finger
- 专利标题（中）： 引线框架带沟槽铅笔
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申请号： US13441924申请日： 2012-04-09
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公开(公告)号： US08643159B2公开(公告)日： 2014-02-04
- 发明人: Wai Keong Wong , Kok Leong Chan , Wei Kee Chan
- 申请人： Wai Keong Wong , Kok Leong Chan , Wei Kee Chan
- 申请人地址： US TX Austin
- 专利权人： Freescale Semiconductor, Inc.
- 当前专利权人： Freescale Semiconductor, Inc.
- 当前专利权人地址： US TX Austin
- 代理商 Charles Bergere
- 主分类号： H01L23/495
- IPC分类号： H01L23/495
摘要：
A lead finger of a lead frame has a number of channels or grooves in a portion of its top surface that provide a locking mechanism for securing a bond wire to the lead finger. The bond wire may be attached to the lead finger by stitch bonding.
公开/授权文献
- US20130264693A1 LEAD FRAME WITH GROOVED LEAD FINGER 公开/授权日：2013-10-10
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