发明授权
- 专利标题： Method for improving surface roughness of processed film of substrate and apparatus for processing substrate
- 专利标题（中）： 改善基板的加工膜的表面粗糙度的方法和基板的处理装置
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申请号： US12574503申请日： 2009-10-06
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公开(公告)号： US08646403B2公开(公告)日： 2014-02-11
- 发明人: Yuichiro Inatomi
- 申请人： Yuichiro Inatomi
- 申请人地址： JP Tokyo
- 专利权人： Tokyo Electron Limited
- 当前专利权人： Tokyo Electron Limited
- 当前专利权人地址： JP Tokyo
- 代理机构： Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- 优先权： JP2003-162054 20030606
- 主分类号： B05C11/00
- IPC分类号： B05C11/00 ; B05C13/00 ; B05C13/02 ; B05C15/00 ; B05B15/04 ; B05B13/02 ; B05B1/26 ; B05B1/28
摘要：
A treatment apparatus for treating a substrate on a surface of which a treatment film has been formed and subjected to exposure processing and developing treatment. The treatment apparatus includes a nozzle for supplying a solvent gas of the treatment film to the surface of the treatment film on the substrate, and a moving mechanism for moving the nozzle which is supplying the solvent gas, relative to the substrate. The nozzle has an elongated discharge portion at least longer than a diameter of the substrate and partition plates at a front and a rear in the moving direction of the nozzle.