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Invention Grant
US08646607B1 Electronic device accessories packaging system and methods thereof 有权
电子设备配件包装系统及其方法

  • Patent Title: Electronic device accessories packaging system and methods thereof
  • Patent Title (中): 电子设备配件包装系统及其方法
  • Application No.: US12113129
    Application Date: 2008-04-30
  • Publication No.: US08646607B1
    Publication Date: 2014-02-11
  • Inventor: Eddie Dana
  • Applicant: Eddie Dana
  • Agent Connie R. Masters
  • Main IPC: B65D85/00
  • IPC: B65D85/00
Electronic device accessories packaging system and methods thereof
Abstract:
An electronic device accessories packaging system and methods of manufacturing, distributing and retailing the electronic device accessories packaging are disclosed.
Abstract(Chinese):

公开了一种电子设备配件包装系统及其制造，分销和零售方法。

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