Invention Grant
- Patent Title: Resin transfer molding device and resin transfer molding method
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Application No.: US13927679Application Date: 2013-06-26
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Publication No.: US08647095B2Publication Date: 2014-02-11
- Inventor: Noriya Hayashi , Hiroshi Mizuno , Koichi Hasegawa , Kazuo Ota
- Applicant: Mitsubishi Heavy Industries, Ltd.
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Heavy Industries, Ltd.
- Current Assignee: Mitsubishi Heavy Industries, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP2006-215580 20060808
- Main IPC: A23G1/22
- IPC: A23G1/22 ; B29C45/14

Abstract:
A resin transfer molding (RTM) molding device is designed to mold a fiber-reinforced plastic (FRP) molded body by injecting a resin composition into a mold and by impregnating the molded body therewith. The resin composition is a chain curing polymer (CCP). A CCP accommodating layer is disposed adjacent to an outer side of the molded body. The layer contains the CCP. The layer is provided with a Vf limit value, the value defined by the curing characteristics of the CCP and the characteristics of dissipation of heat from the CCP to the exterior. An element for separating the molded body is disposed between the body and the layer.
Public/Granted literature
- US20130287877A1 RESIN TRANSFER MOLDING DEVICE AND RESIN TRANSFER MOLDING METHOD Public/Granted day:2013-10-31
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