发明授权
- 专利标题: Process control apparatus and laser processing apparatus
- 专利标题(中): 过程控制装置和激光加工装置
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申请号: US12936120申请日: 2009-04-03
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公开(公告)号: US08648279B2公开(公告)日: 2014-02-11
- 发明人: Keiji Takahashi , Tomonori Mukae , Shigeru Yokoi , Tatsuya Yamamoto
- 申请人: Keiji Takahashi , Tomonori Mukae , Shigeru Yokoi , Tatsuya Yamamoto
- 申请人地址: JP Tokyo
- 专利权人: Mitsubishi Electric Corporation
- 当前专利权人: Mitsubishi Electric Corporation
- 当前专利权人地址: JP Tokyo
- 代理机构: Sughrue Mion, PLLC
- 优先权: JP2008-098524 20080404
- 国际申请: PCT/JP2009/001575 WO 20090403
- 国际公布: WO2009/122758 WO 20091008
- 主分类号: B23K26/04
- IPC分类号: B23K26/04
摘要:
A process control apparatus controls a focus position of a laser beam, while a laser processing mechanism converges the laser beam into a predetermined focus position and performs a laser processing on a workpiece. The process control apparatus includes: a calculator that, based on the magnitude of an output of the laser beam that changes during the laser processing, calculates a change amount of a positional deviation of the focus position in an optical axis direction that changes during the laser processing at a laser beam radiation position; and a control unit that, based on the change amount of the positional deviation that has been calculated by the calculator, controls the focus position of the laser beam during the laser processing so as to resolve the positional deviation of the focus position.
公开/授权文献
- US20110042360A1 PROCESS CONTROL APPARATUS AND LASER PROCESSING APPARATUS 公开/授权日:2011-02-24
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