发明授权
- 专利标题： Flexible heat sink having ventilation ports and semiconductor package including the same
- 专利标题（中）： 具有通风口的柔性散热器和包括其的半导体封装
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申请号： US13158486申请日： 2011-06-13
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公开(公告)号： US08648478B2公开(公告)日： 2014-02-11
- 发明人: Jae-Wook Yoo , Kyoung-Sei Choi , Eun-Seok Cho , Mi-Na Choi , Hee-Jung Hwang , Se-Ran Bae
- 申请人： Jae-Wook Yoo , Kyoung-Sei Choi , Eun-Seok Cho , Mi-Na Choi , Hee-Jung Hwang , Se-Ran Bae
- 申请人地址： KR Suwon-si, Gyeonggi-do
- 专利权人： Samsung Electronics Co., Ltd.
- 当前专利权人： Samsung Electronics Co., Ltd.
- 当前专利权人地址： KR Suwon-si, Gyeonggi-do
- 代理机构： Volentine & Whitt, PLLC
- 优先权： KR10-2010-0060572 20100625
- 主分类号： H01L23/373
- IPC分类号： H01L23/373 ; F28F7/00
摘要：
A heat sink includes a first adhesive layer, and a heat dissipation layer disposed on the first adhesive layer, and has ventilation ports that extend therethrough including through the first adhesive layer and the heat dissipation layer. The heat sink forms an outermost part of a semiconductor package. Thus, when the heat sink is bonded via its adhesive layer to underlying structure during a manufacturing process, the ventilation ports allow air to pass therethrough. As a result, air is not trapped in the form of bubbles between the heat sink and the underlying structure.