Invention Grant
- Patent Title: Rotor lamination cooling system and method
- Patent Title (中): 转子层压冷却系统及方法
-
Application No.: US12942881Application Date: 2010-11-09
-
Publication No.: US08648506B2Publication Date: 2014-02-11
- Inventor: Michael D. Bradfield
- Applicant: Michael D. Bradfield
- Applicant Address: US IN Pendleton
- Assignee: Remy Technologies, LLC
- Current Assignee: Remy Technologies, LLC
- Current Assignee Address: US IN Pendleton
- Agency: Greenberg Traurig LLP
- Main IPC: H02K9/00
- IPC: H02K9/00

Abstract:
Some embodiments of the invention provide an electric machine module including a rotor assembly. The rotor assembly can include a rotor hub, a first set of rotor laminations which can include a portion having a first inner radius, and a second set of rotor laminations which can include a portion having a second inner radius larger than the first inner radius. At least one circumferential flow channel defined by the first set of rotor laminations, the second set of rotor laminations, and the rotor hub can at least partially circumscribe the rotor hub.
Public/Granted literature
- US20120112574A1 Rotor Lamination Cooling System and Method Public/Granted day:2012-05-10
Information query