Invention Grant
US08649072B2 Imaging system, solid-state imaging device for the imaging system, and method for manufacturing the solid-state imaging device for the imaging system
有权
成像系统,用于成像系统的固态成像装置和用于制造用于成像系统的固态成像装置的方法
- Patent Title: Imaging system, solid-state imaging device for the imaging system, and method for manufacturing the solid-state imaging device for the imaging system
- Patent Title (中): 成像系统,用于成像系统的固态成像装置和用于制造用于成像系统的固态成像装置的方法
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Application No.: US13417452Application Date: 2012-03-12
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Publication No.: US08649072B2Publication Date: 2014-02-11
- Inventor: Hirokazu Sekine
- Applicant: Hirokazu Sekine
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2011-121833 20110531
- Main IPC: H04N1/04
- IPC: H04N1/04

Abstract:
Certain embodiments provide an imaging system including a light guiding member supported on a circuit substrate so as to be capable of lighting an object, an optical image-forming member and a solid-state imaging device. The optical image-forming member is arranged on the circuit substrate so as to have an optical axis thereof parallel to the circuit substrate, is arranged on the circuit substrate so as to be able to receive reflected light from the object, emits the reflected light in an oblique direction with respect to a surface of the circuit substrate, and forms an image at a predetermined distance position. The solid-state imaging device includes a light receiving surface that is oblique with respect to the circuit substrate surface, and is mounted on the surface of the circuit substrate so as to have the receiving surface positioned at a position where the image is formed.
Public/Granted literature
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