Invention Grant
US08650823B2 Subfloor component and method of manufacturing same 有权
底板构件及其制造方法

  • Patent Title: Subfloor component and method of manufacturing same
  • Patent Title (中): 底板构件及其制造方法
  • Application No.: US13412038
    Application Date: 2012-03-05
  • Publication No.: US08650823B2
    Publication Date: 2014-02-18
  • Inventor: Victor Amend
  • Applicant: Victor Amend
  • Main IPC: E04C1/00
  • IPC: E04C1/00
Subfloor component and method of manufacturing same
Abstract:
A subfloor component includes an insulating foam panel having first and second opposing faces and a plurality of intersecting grooves to define, in cross-section, a plurality of pedestals having walls that extend into the panel from the first face toward the second face. The subfloor component also includes a moisture-resistant film attached to the first face of the panel and that conforms to the pedestals, and a hardboard layer on the second face of the panel. A method of manufacturing subfloor components is also disclosed.
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