Invention Grant
- Patent Title: Subfloor component and method of manufacturing same
- Patent Title (中): 底板构件及其制造方法
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Application No.: US13412038Application Date: 2012-03-05
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Publication No.: US08650823B2Publication Date: 2014-02-18
- Inventor: Victor Amend
- Applicant: Victor Amend
- Main IPC: E04C1/00
- IPC: E04C1/00

Abstract:
A subfloor component includes an insulating foam panel having first and second opposing faces and a plurality of intersecting grooves to define, in cross-section, a plurality of pedestals having walls that extend into the panel from the first face toward the second face. The subfloor component also includes a moisture-resistant film attached to the first face of the panel and that conforms to the pedestals, and a hardboard layer on the second face of the panel. A method of manufacturing subfloor components is also disclosed.
Public/Granted literature
- US20130227903A1 SUBFLOOR COMPONENT AND METHOD OF MANUFACTURING SAME Public/Granted day:2013-09-05
Information query
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