Invention Grant
US08651356B2 Solder bump forming apparatus and soldering facility including the same
有权
焊接凸块形成装置和包括其的焊接设备
- Patent Title: Solder bump forming apparatus and soldering facility including the same
- Patent Title (中): 焊接凸块形成装置和包括其的焊接设备
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Application No.: US13675235Application Date: 2012-11-13
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Publication No.: US08651356B2Publication Date: 2014-02-18
- Inventor: Noriaki Mukai , Hueng Jae Oh , Dae Young Lee , Jin Won Choi
- Applicant: Samsung Electro-Mechanics Co., Ltd.
- Applicant Address: KR Suwon
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon
- Priority: KR10-2011-0125896 20111129
- Main IPC: B23K1/00
- IPC: B23K1/00 ; B23K1/08
Abstract:
Disclosed herein is a solder bump forming apparatus performing a soldering process on a substrate, the solder bump forming apparatus including: a solder bath receiving a solder therein; an agitator agitating the solder in the solder bath; a driver driving the agitator; and a suction pressure provider providing suction pressure to the substrate.
Public/Granted literature
- US20130134208A1 SOLDER BUMP FORMING APPARATUS AND SOLDERING FACILITY INCLUDING THE SAME Public/Granted day:2013-05-30
Information query
IPC分类:
