Invention Grant
- Patent Title: Placement device for assembling components in electronic devices
- Patent Title (中): 用于在电子设备中组装组件的放置装置
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Application No.: US12665577Application Date: 2008-06-19
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Publication No.: US08651542B2Publication Date: 2014-02-18
- Inventor: Roger Gortzen , Ronald Plak , Jorg Balder Van Schijndel
- Applicant: Roger Gortzen , Ronald Plak , Jorg Balder Van Schijndel
- Applicant Address: NL Delft
- Assignee: Nederlandse Organisatie Voor Toegepast-Natuurwetenschappelijk Onderzoek TNO
- Current Assignee: Nederlandse Organisatie Voor Toegepast-Natuurwetenschappelijk Onderzoek TNO
- Current Assignee Address: NL Delft
- Agency: Dorsey & Whitney, LLP
- Priority: EP07110566 20070619
- International Application: PCT/NL2008/050397 WO 20080619
- International Announcement: WO2008/156359 WO 20081224
- Main IPC: B25B5/04
- IPC: B25B5/04 ; B25J15/06
Abstract:
A placement device comprises a vacuum gripper (110) and a holder (120). The gripper, formed as a vacuum needle, is movable relative to the holder along a first axis. The gripper and the holder are mutually coupled by a membrane (160) allowing the gripper to tilt away from the first axis.
Public/Granted literature
- US20100215462A1 PLACEMENT DEVICE FOR ASSEMBLING COMPONENTS IN ELECTRONIC DEVICES Public/Granted day:2010-08-26
Information query
