发明授权
- 专利标题: Apparatus for holding semiconductor wafers
- 专利标题(中): 用于保持半导体晶片的装置
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申请号: US12347580申请日: 2008-12-31
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公开(公告)号: US08652260B2公开(公告)日: 2014-02-18
- 发明人: Chen-Hua Yu , Chien Ling Hwang
- 申请人: Chen-Hua Yu , Chien Ling Hwang
- 申请人地址: TW Hsin-Chu
- 专利权人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址: TW Hsin-Chu
- 代理机构: Slater & Matsil, L.L.P.
- 主分类号: C23C16/00
- IPC分类号: C23C16/00 ; C23F1/00 ; H01L21/306
摘要:
Apparatus for holding semiconductor wafers during semiconductor manufacturing processes are disclosed. In one embodiment, the apparatus comprises a heat-conductive layer disposed on a supporting base. The apparatus also comprises a plurality of holes formed through the heat-conductive layer and the supporting base. The apparatus further comprises a plurality of heat-conductive lift pins that extend through the holes over the heat-conductive layer at the top end, and make a direct contact with a wafer substrate. The heat-conductive layer and the lift pins are connected to a heating circuit.
公开/授权文献
- US20100032096A1 Apparatus for Holding Semiconductor Wafers 公开/授权日:2010-02-11
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