Invention Grant
US08652923B2 Nonvolatile memory device having an electrode interface coupling region
有权
具有电极接口耦合区域的非易失性存储器件
- Patent Title: Nonvolatile memory device having an electrode interface coupling region
- Patent Title (中): 具有电极接口耦合区域的非易失性存储器件
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Application No.: US13829194Application Date: 2013-03-14
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Publication No.: US08652923B2Publication Date: 2014-02-18
- Inventor: Yun Wang , Tony P. Chiang , Imran Hashim
- Applicant: Intermolecular Inc. , Kabushiki Kaisha Toshiba , SanDisk 3D LLC
- Applicant Address: US CA San Jose JP Tokyo US CA Milpitas
- Assignee: Intermolecular, Inc.,Kabushiki Kaisha Toshiba,SanDisk 3D LLC
- Current Assignee: Intermolecular, Inc.,Kabushiki Kaisha Toshiba,SanDisk 3D LLC
- Current Assignee Address: US CA San Jose JP Tokyo US CA Milpitas
- Main IPC: H01L21/20
- IPC: H01L21/20

Abstract:
Embodiments of the invention generally relate to a resistive switching nonvolatile memory device having an interface layer structure disposed between at least one of the electrodes and a variable resistance layer formed in the nonvolatile memory device, and a method of forming the same. Typically, resistive switching memory elements may be formed as part of a high-capacity nonvolatile memory integrated circuit, which can be used in various electronic devices, such as digital cameras, mobile telephones, handheld computers, and music players. In one configuration of the resistive switching nonvolatile memory device, the interface layer structure comprises a passivation region, an interface coupling region, and/or a variable resistance layer interface region that are configured to adjust the nonvolatile memory device's performance, such as lowering the formed device's switching currents and reducing the device's forming voltage, and reducing the performance variation from one formed device to another.
Public/Granted literature
- US20130217179A1 Nonvolatile Memory Device Having An Electrode Interface Coupling Region Public/Granted day:2013-08-22
Information query
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