发明授权
US08653380B2 Solar cell lead, method of manufacturing the same, and solar cell using the same
有权
太阳能电池引线及其制造方法以及使用其的太阳能电池
- 专利标题： Solar cell lead, method of manufacturing the same, and solar cell using the same
- 专利标题（中）： 太阳能电池引线及其制造方法以及使用其的太阳能电池
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申请号： US12659172申请日： 2010-02-26
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公开(公告)号： US08653380B2公开(公告)日： 2014-02-18
- 发明人: Hajime Nishi , Ken Takahashi , Hiromitsu Kuroda , Hiroshi Okikawa , Kuniaki Kimoto , Hiroyuki Akutsu , Yukio Ito , Iku Higashidani
- 申请人： Hajime Nishi , Ken Takahashi , Hiromitsu Kuroda , Hiroshi Okikawa , Kuniaki Kimoto , Hiroyuki Akutsu , Yukio Ito , Iku Higashidani
- 申请人地址： JP Tokyo JP Hitachi-Shi, Ibaraki
- 专利权人： Hitachi Cable, Ltd.,Hitachi Cable Fine-Tech, Ltd.
- 当前专利权人： Hitachi Cable, Ltd.,Hitachi Cable Fine-Tech, Ltd.
- 当前专利权人地址： JP Tokyo JP Hitachi-Shi, Ibaraki
- 代理机构： McGinn IP Law Group, PLLC
- 优先权： JP2009-047033 20090227
- 主分类号： H05K1/16
- IPC分类号： H05K1/16
摘要：
A solar cell lead includes a strip plate conductive material that a surface thereof is coated with solder plating. The coated solder plating includes a concavo-convex portion on a surface thereof and a 0.2% proof stress of not more than 90 MPa by a tensile test. The coated solder plating includes a hot-dip solder plating layer formed by supplying a molten solder on the surface of the strip plate conductive material. A plating temperature is set to be not higher than a liquidus-line temperature of the used solder plus 120° C., and an oxide film on a surface of the hot-dip solder plating layer is set to be not more than 7 nm in thickness.