发明授权
- 专利标题: Multichip packaging for imaging system
- 专利标题(中): 用于成像系统的多芯片包装
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申请号: US13526919申请日: 2012-06-19
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公开(公告)号: US08653467B2公开(公告)日: 2014-02-18
- 发明人: Stephen H. Black , Michael A. Gritz , Adam M. Kennedy
- 申请人: Stephen H. Black , Michael A. Gritz , Adam M. Kennedy
- 申请人地址: US MA Waltham
- 专利权人: Raytheon Company
- 当前专利权人: Raytheon Company
- 当前专利权人地址: US MA Waltham
- 代理机构: Cantor Colburn LLP
- 主分类号: G01T1/24
- IPC分类号: G01T1/24
摘要:
A receiver chip for use in an imaging system includes a plurality of receiver dies, each of the receiver dies comprising one or more receiver circuits; a die interconnection layer located on top of the plurality of receiver dies; a quarter wave dielectric layer located on top of the die interconnection layer; and a plurality of antennae located on the quarter wave dielectric layer, each of the plurality of antennae corresponding to a respective receiver circuit, wherein the plurality of antennae are connected to the one or more receiver circuits through the quarter wave dielectric layer and the die interconnection layer by respective vias, such that a distance between a topmost layer of the die interconnection layer and the plurality of antennae is determined by a thickness of the quarter wave dielectric layer.
公开/授权文献
- US20130334425A1 Multichip Packaging for Imaging System 公开/授权日:2013-12-19