发明授权
- 专利标题: Heating phase change material
- 专利标题(中): 加热相变材料
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申请号: US11103188申请日: 2005-04-11
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公开(公告)号: US08653495B2公开(公告)日: 2014-02-18
- 发明人: Guy C. Wicker , Fabio Pellizzer , Enrico Varesi , Agostino Pirovano
- 申请人: Guy C. Wicker , Fabio Pellizzer , Enrico Varesi , Agostino Pirovano
- 申请人地址: US ID Boise
- 专利权人: Micron Technology, Inc.
- 当前专利权人: Micron Technology, Inc.
- 当前专利权人地址: US ID Boise
- 代理机构: Dorsey & Whitney LLP
- 主分类号: H01L21/06
- IPC分类号: H01L21/06 ; H01L45/00
摘要:
A phase change memory may be formed of two vertically spaced layers of phase change material. An intervening dielectric may space the layers from one another along a substantial portion of their lateral extent. An opening may be provided in the intervening dielectric to allow the phase change layers to approach one another more closely. As a result, current density may be increased at this location, producing heat
公开/授权文献
- US20060226410A1 Heating phase change material 公开/授权日:2006-10-12
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