Invention Grant
- Patent Title: FinFET design with reduced current crowding
- Patent Title (中): FinFET设计,减少电流拥挤
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Application No.: US12842281Application Date: 2010-07-23
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Publication No.: US08653608B2Publication Date: 2014-02-18
- Inventor: Tsung-Lin Lee , Chih Chieh Yeh
- Applicant: Tsung-Lin Lee , Chih Chieh Yeh
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L27/088
- IPC: H01L27/088

Abstract:
An integrated circuit structure includes a substrate and a fin field-effect transistor (FinFET). The FinFET includes a fin over the substrate and having a first fin portion and a second fin portion. A gate stack is formed on a top surface and sidewalls of the first fin portion. An epitaxial semiconductor layer has a first portion formed directly over the second fin portion, and a second portion formed on sidewalls of the second fin portion. A silicide layer is formed on the epitaxial semiconductor layer. A peripheral ratio of a total length of an effective silicide peripheral of the FinFET to a total length of a fin peripheral of the FinFET is greater than 1.
Public/Granted literature
- US20110095378A1 FinFET Design with Reduced Current Crowding Public/Granted day:2011-04-28
Information query
IPC分类: