发明授权
- 专利标题： Package structures including a capacitor and methods of forming the same
- 专利标题（中）： 封装结构包括电容器及其形成方法
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申请号： US13551676申请日： 2012-07-18
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公开(公告)号： US08653626B2公开(公告)日： 2014-02-18
- 发明人: Sut-I Lo , Ching-Wen Hsiao , Hsu-Hsien Chen , Chen-Shien Chen
- 申请人： Sut-I Lo , Ching-Wen Hsiao , Hsu-Hsien Chen , Chen-Shien Chen
- 申请人地址： TW Hsin-Chu
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW Hsin-Chu
- 代理机构： Slater & Matsil, L.L.P.
- 主分类号： H01L23/34
- IPC分类号： H01L23/34 ; H01L23/48 ; H01L23/52 ; H01L29/40 ; H01L21/00
摘要：
A package includes a die, an encapsulant, and a capacitor. The package has a package first side and a package second side. The die has a die first side corresponding to the package first side, and has a die second side corresponding to the package second side. The die first side is opposite the die second side. The encapsulant surrounds the die. The capacitor includes a first plate and a second plate in the encapsulant, and opposing surfaces of the first plate and the second plate extend in a direction from the package first side to the package second side. The external conductive connectors are attached to at least one of the package first side and the package second side.
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