Invention Grant
US08653638B2 Integrated circuit package with multiple dies and bundling of control signals
有权
具有多个管芯和集束控制信号的集成电路封装
- Patent Title: Integrated circuit package with multiple dies and bundling of control signals
- Patent Title (中): 具有多个管芯和集束控制信号的集成电路封装
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Application No.: US12958646Application Date: 2010-12-02
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Publication No.: US08653638B2Publication Date: 2014-02-18
- Inventor: Andrew Michael Jones , Stuart Ryan
- Applicant: Andrew Michael Jones , Stuart Ryan
- Applicant Address: GB Marlow, Buckinghamshire
- Assignee: STMicroelectronics (Research & Development) Limited
- Current Assignee: STMicroelectronics (Research & Development) Limited
- Current Assignee Address: GB Marlow, Buckinghamshire
- Agency: Gardere Wynne Sewell LLP
- Priority: EP09178183 20091207
- Main IPC: H01L23/02
- IPC: H01L23/02 ; H01L29/40 ; H01L21/00
Abstract:
A package includes a first die and a second die, at least one of said first and second dies being a memory. The dies are connected to each other through an interface. The interface is configured to transport a plurality of control signals. The number of control signals is greater than a width of the interface. At least one of the first and second dies performs a configurable grouping so as to provide a plurality of groups of control signals. The signals within a group are transmitted across the interface together.
Public/Granted literature
- US20110261603A1 INTEGRATED CIRCUIT PACKAGE WITH MULTIPLE DIES AND BUNDLING OF CONTROL SIGNALS Public/Granted day:2011-10-27
Information query
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