Invention Grant
- Patent Title: Expandable circuit carrier
- Patent Title (中): 可扩展电路载体
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Application No.: US11940640Application Date: 2007-11-15
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Publication No.: US08654536B2Publication Date: 2014-02-18
- Inventor: Andreas Ostmann , Manuel Seckel , Thomas Löher , Dionysios Manessis , Rainer Patzelt
- Applicant: Andreas Ostmann , Manuel Seckel , Thomas Löher , Dionysios Manessis , Rainer Patzelt
- Applicant Address: DE Munich
- Assignee: Fraunhofer-Gesellschaft zur Forderung der Angewandten Forschung E.V.
- Current Assignee: Fraunhofer-Gesellschaft zur Forderung der Angewandten Forschung E.V.
- Current Assignee Address: DE Munich
- Agency: Barnes & Thornburg LLP
- Priority: DE102006055576 20061121
- Main IPC: H05K1/00
- IPC: H05K1/00
Abstract:
The present invention relates to a method for the production of an expandable circuit carrier in which a starting material for an expandable substrate is applied on an electrically conductive foil which forms an expandable substrate layer which is connected to the foil, after which the foil is structured such that it forms a conductor structure having at least one expandable strip conductor. The present invention further relates to an expandable circuit carrier which can be produced by the method.
Public/Granted literature
- US20080257589A1 Method for the production of expandable circuit carrier and expandable circuit carrier Public/Granted day:2008-10-23
Information query
