Invention Grant
- Patent Title: Rotary damper mounting assembly and rotary damper apparatus
- Patent Title (中): 旋转阻尼器安装组件和旋转阻尼器装置
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Application No.: US13105771Application Date: 2011-05-11
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Publication No.: US08657086B2Publication Date: 2014-02-25
- Inventor: Shinpei Iwata
- Applicant: Shinpei Iwata
- Applicant Address: JP Tokyo
- Assignee: Sugatsune Kogyo Co., Ltd.
- Current Assignee: Sugatsune Kogyo Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Osha Liang LLP
- Priority: JP2010-111138 20100513
- Main IPC: F16F9/32
- IPC: F16F9/32 ; F16F9/54

Abstract:
An identical engagement hole 12b is formed in each of first and second brackets 1, 2. A first engagement portion 31c is formed in a damper body 31 of a rotary damper 3. A distal end portion of a rotor 32 of the rotary damper 3 is non-rotatably inserted in an adapter 4. A third engagement portion 46 is formed in an outer circumference of the adapter 4. The first engagement portion 31c is non-rotatably inserted in the engagement hole 12b of the first bracket 1. The third engagement portion 46 is non-rotatably inserted in the engagement hole 12b of the second bracket 2.
Public/Granted literature
- US20110278119A1 ROTARY DAMPER MOUNTING ASSEMBLY AND ROTARY DAMPER APPARATUS Public/Granted day:2011-11-17
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