Invention Grant
- Patent Title: Micro-ejection device
- Patent Title (中): 微型喷射装置
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Application No.: US13358345Application Date: 2012-01-25
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Publication No.: US08657412B2Publication Date: 2014-02-25
- Inventor: Sang Jin Kim , Bo Sung Ku
- Applicant: Sang Jin Kim , Bo Sung Ku
- Applicant Address: KR Suwon
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2011-0099781 20110930
- Main IPC: B41J2/14
- IPC: B41J2/14
Abstract:
There is provided a micro-ejection device including: an ejector ejecting a fluid; and a body having an installation space in which the ejector is installed, wherein the installation space is provided with a guide unit inducing a line-contact or a point-contact between the ejector and the body.
Public/Granted literature
- US20130083127A1 MICRO-EJECTION DEVICE Public/Granted day:2013-04-04
Information query
IPC分类:
