Invention Grant
- Patent Title: Vertical connector for a printed circuit board
- Patent Title (中): 用于印刷电路板的垂直连接器
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Application No.: US13201802Application Date: 2010-02-18
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Publication No.: US08657631B2Publication Date: 2014-02-25
- Inventor: Harold Keith Lang , Kent E. Regnier , John Jantelezio
- Applicant: Harold Keith Lang , Kent E. Regnier , John Jantelezio
- Applicant Address: US IL Lisle
- Assignee: Molex Incorporated
- Current Assignee: Molex Incorporated
- Current Assignee Address: US IL Lisle
- Agent Stephen L. Sheldon
- International Application: PCT/US2010/024598 WO 20100218
- International Announcement: WO2010/096567 WO 20100826
- Main IPC: H01R24/00
- IPC: H01R24/00

Abstract:
An connector assembly is provided that may be utilized for vertical applications on a circuit board. The assembly includes a housing that supports a plurality of wafers that in tern support a plurality of terminals. The housing includes a base and a nose and can have two slots in the nose and the terminals extend to both slots. A guide frame can be positioned on the housing to help support the housing. The terminals can be arranged in a row on both sides of the two slots. The tails of the terminals can be configured with respect to the slots so as to provide desirable performance.
Public/Granted literature
- US20120034820A1 VERTICAL CONNECTOR FOR A PRINTED CIRCUIT BOARD Public/Granted day:2012-02-09
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