Invention Grant
- Patent Title: Pressure relief in high pressure processing system
- Patent Title (中): 高压处理系统中的减压
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Application No.: US12917284Application Date: 2010-11-01
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Publication No.: US08658100B2Publication Date: 2014-02-25
- Inventor: Goutam Biswas , Darush Farshid , Lucy Wu , James Knight , David Bosi , Michael K. Porter
- Applicant: Goutam Biswas , Darush Farshid , Lucy Wu , James Knight , David Bosi , Michael K. Porter
- Applicant Address: US CA San Ramon
- Assignee: Chevron U.S.A. Inc.
- Current Assignee: Chevron U.S.A. Inc.
- Current Assignee Address: US CA San Ramon
- Main IPC: B01J8/00
- IPC: B01J8/00

Abstract:
The present disclosure provides a system and method for responding to an unintended increase in pressure within a high pressure processing system. The system and method of the present disclosure provides a pressure relief system that releases pressure reliably even if the material under pressure is of mixed phase. In addition, the system and method for releasing pressure avoids the need for complex subsystems to contain and process materials that escape the system during the pressure release process.
Public/Granted literature
- US20120103866A1 PRESSURE RELIEF IN HIGH PRESSURE PROCESSING SYSTEM Public/Granted day:2012-05-03
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