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发明授权
US08658346B2 Pattern forming process, chemically amplified positive resist composition, and resist-modifying composition 有权
图案形成工艺，化学放大正性抗蚀剂组合物和抗蚀剂改性组合物

Pattern forming process, chemically amplified positive resist composition, and resist-modifying composition
摘要：
A pattern is formed by (1) coating a first positive resist composition onto a substrate, baking, patternwise exposing, PEB, and developing to form a first positive resist pattern including a large area feature, (2) applying a resist-modifying composition comprising a basic nitrogen-containing compound and heating to modify the first resist pattern, and (3) coating a second positive resist composition thereon, patternwise exposing, and developing to form a second resist pattern. The large area feature in the first resist pattern has a film retentivity of at least 50% after the second pattern formation.
摘要（中）：

通过（1）将第一正性抗蚀剂组合物涂布在基材上，烘烤，图案曝光，PEB和显影以形成包括大面积特征的第一正性抗蚀剂图案，（2）涂覆抗蚀剂改性组合物，形成图案，所述抗蚀剂改性组合物包含 碱性含氮化合物和加热以改性第一抗蚀剂图案，和（3）在其上涂覆第二正性抗蚀剂组合物，图案曝光和显影以形成第二抗蚀剂图案。 第一抗蚀剂图案中的大面积特征在第二图案形成之后具有至少50％的膜保持性。

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