Invention Grant
- Patent Title: Capacitive micromachined ultrasonic transducer
- Patent Title (中): 电容式微加工超声波换能器
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Application No.: US11612659Application Date: 2006-12-19
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Publication No.: US08658453B2Publication Date: 2014-02-25
- Inventor: David F. Lemmerhirt , Collin A. Rich
- Applicant: David F. Lemmerhirt , Collin A. Rich
- Applicant Address: US MI Ann Arbor
- Assignee: Sonetics Ultrasound, Inc.
- Current Assignee: Sonetics Ultrasound, Inc.
- Current Assignee Address: US MI Ann Arbor
- Agent Jeffrey Schox
- Main IPC: H01L21/00
- IPC: H01L21/00

Abstract:
The first integrated circuit/transducer device 36 of the handheld probe includes CMOS circuits 110 and cMUT elements 112. The cMUT elements 112 function to generate an ultrasonic beam, detect an ultrasonic echo, and output electrical signals, while the CMOS circuits 110 function to perform analog or digital operations on the electrical signals generated through operation of the cMUT elements 112. The manufacturing method for the first integrated circuit/transducer device 36 of the preferred embodiment includes the steps of depositing the lower electrode S102; depositing a sacrificial layer S104; depositing a dielectric layer S106; removing the sacrificial layer S108, followed by the steps of depositing the upper electrode S110 and depositing a protective layer on the upper electrode S112.
Public/Granted literature
- US20070167812A1 Capacitive Micromachined Ultrasonic Transducer Public/Granted day:2007-07-19
Information query
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