Invention Grant
US08659075B2 Cross-point diode arrays and methods of manufacturing cross-point diode arrays
有权
交叉点二极管阵列和制造交叉点二极管阵列的方法
- Patent Title: Cross-point diode arrays and methods of manufacturing cross-point diode arrays
- Patent Title (中): 交叉点二极管阵列和制造交叉点二极管阵列的方法
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Application No.: US13751902Application Date: 2013-01-28
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Publication No.: US08659075B2Publication Date: 2014-02-25
- Inventor: John Zahurak , Sanh D. Tang , Gurtej S. Sandhu
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Perkins Coie LLP
- Main IPC: H01L29/66
- IPC: H01L29/66

Abstract:
Methods of forming an array of memory cells and memory cells that have pillars. Individual pillars can have a semiconductor post formed of a bulk semiconductor material and a sacrificial cap on the semiconductor post. Source regions can be between columns of the pillars, and gate lines extend along a column of pillars and are spaced apart from corresponding source regions. Each gate line surrounds a portion of the semiconductor posts along a column of pillars. The sacrificial cap structure can be selectively removed to thereby form self-aligned openings that expose a top portion of corresponding semiconductor posts. Individual drain contacts formed in the self-aligned openings are electrically connected to corresponding semiconductor posts.
Public/Granted literature
- US20130134503A1 CROSS-POINT DIODE ARRAYS AND METHODS OF MANUFACTURING CROSS-POINT DIODE ARRAYS Public/Granted day:2013-05-30
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