Invention Grant
- Patent Title: Adhesive application apparatus
- Patent Title (中): 粘合剂涂布装置
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Application No.: US12881710Application Date: 2010-09-14
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Publication No.: US08662009B2Publication Date: 2014-03-04
- Inventor: Takashi Ando , Eijiro Furuta , Akira Honma
- Applicant: Takashi Ando , Eijiro Furuta , Akira Honma
- Applicant Address: JP Kanagawa
- Assignee: NHK Spring Co., Ltd.
- Current Assignee: NHK Spring Co., Ltd.
- Current Assignee Address: JP Kanagawa
- Agency: Jordan and Hamburg LLP
- Priority: JPP2009-212689 20090915
- Main IPC: B05C5/00
- IPC: B05C5/00 ; B05D7/24 ; B05D7/00 ; B05D1/26 ; B05D1/00

Abstract:
An adhesive application apparatus for applying a liquid adhesive to an object includes a regular application stage against which the object is placed for a regular application of the liquid adhesive to the object, a trial application stage to which a trial application of the liquid adhesive is carried out, an application unit relatively movable with respect to the regular application stage and trial application stage to carry out the regular application and trial application of the liquid adhesive, and a suction unit carrying out a suction operation of the liquid adhesive used in the trial application. The adhesive application apparatus smoothly carries out the trial application of the liquid adhesive without bothering the operation of an adhesive application line.
Public/Granted literature
- US20110061594A1 ADHESIVE APPLICATION APPARATUS Public/Granted day:2011-03-17
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