Invention Grant
US08663764B2 Overmolded composite structure for an electronic device 失效
用于电子设备的包覆成型复合结构

  • Patent Title: Overmolded composite structure for an electronic device
  • Patent Title (中): 用于电子设备的包覆成型复合结构
  • Application No.: US13621874
    Application Date: 2012-09-18
  • Publication No.: US08663764B2
    Publication Date: 2014-03-04
  • Inventor: Rong LuoXinyu Zhao
  • Applicant: Ticona LLC
  • Applicant Address: US KY Florence
  • Assignee: Ticona LLC
  • Current Assignee: Ticona LLC
  • Current Assignee Address: US KY Florence
  • Agency: Dority & Manning, P.A.
  • Main IPC: B29D22/00
  • IPC: B29D22/00
Overmolded composite structure for an electronic device
Abstract:
An overmolded composite structure that contains a metal component and a resinous component adhered to a surface thereof is provided. The resinous component is formed from a thermoplastic composition that contains at least one polyarylene sulfide and at least one mineral filler. The present inventors have discovered that the nature and relative concentration of the polyarylene sulfides, mineral fillers, and/or other materials in the thermoplastic composition can be selectively tailored so that the resulting resinous component has a coefficient of linear thermal expansion and/or color that is similar to the metal component.
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