Invention Grant
- Patent Title: Semiconductor die package and method for making the same
- Patent Title (中): 半导体管芯封装及其制造方法
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Application No.: US13430347Application Date: 2012-03-26
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Publication No.: US08664752B2Publication Date: 2014-03-04
- Inventor: Oseob Jeon , Yoonhwa Choi , Boon Huan Gooi , Maria Cristina B. Estacio , David Chong , Tan Teik Keng , Shibaek Nam , Rajeev Joshi , Chung-Lin Wu , Venkat Iyer , Lay Yeap Lim , Byoung-Ok Lee
- Applicant: Oseob Jeon , Yoonhwa Choi , Boon Huan Gooi , Maria Cristina B. Estacio , David Chong , Tan Teik Keng , Shibaek Nam , Rajeev Joshi , Chung-Lin Wu , Venkat Iyer , Lay Yeap Lim , Byoung-Ok Lee
- Applicant Address: US CA San Jose
- Assignee: Fairchild Semiconductor Corporation
- Current Assignee: Fairchild Semiconductor Corporation
- Current Assignee Address: US CA San Jose
- Agency: Christensen O'Connor Johnson Kindness PLLC
- Main IPC: H01L23/495
- IPC: H01L23/495
Abstract:
Semiconductor die packages are disclosed. An exemplary semiconductor die package includes a premolded substrate. The premolded substrate can have a semiconductor die attached to it, and an encapsulating material may be disposed over the semiconductor die.
Public/Granted literature
- US20120181675A1 SEMICONDUCTOR DIE PACKAGE AND METHOD FOR MAKING THE SAME Public/Granted day:2012-07-19
Information query
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