Invention Grant
- Patent Title: Power module package and method for manufacturing the same
- Patent Title (中): 电源模块封装及其制造方法
-
Application No.: US13247603Application Date: 2011-09-28
-
Publication No.: US08664755B2Publication Date: 2014-03-04
- Inventor: Chang Hyun Lim , Young Ki Lee , Kwang Soo Kim , Seog Moon Choi
- Applicant: Chang Hyun Lim , Young Ki Lee , Kwang Soo Kim , Seog Moon Choi
- Applicant Address: KR Gyunggi-Do
- Assignee: Samsung Electro-Mechanics Co., Ltd
- Current Assignee: Samsung Electro-Mechanics Co., Ltd
- Current Assignee Address: KR Gyunggi-Do
- Agency: Ladas & Parry, LLP
- Priority: KR10-2011-0066046 20110704
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L21/00
Abstract:
Disclosed herein is a power module package including: a first substrate; a second substrate having a pad for connection to the first substrate formed on one side or both sides of one surface thereof and having external connection terminals for connection to the outside formed on the other surface thereof; and a lead frame having one end bonded to the first substrate and the other end bonded to the pad of the second substrate to thereby vertically connect the first and second substrates to each other.
Public/Granted literature
- US20130009290A1 POWER MODULE PACKAGE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2013-01-10
Information query
IPC分类:
