发明授权
- 专利标题： Reconstituted wafer package with high voltage discrete active dice and integrated field plate for high temperature leakage current stability
- 专利标题（中）： 具有高压离散有源芯片和集成现场板的重构晶片封装，用于高温漏电流稳定性
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申请号： US13556385申请日： 2012-07-24
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公开(公告)号： US08664756B2公开(公告)日： 2014-03-04
- 发明人: Mark R. Boone , Mohsen Askarinya , Larry E. Tyler
- 申请人： Mark R. Boone , Mohsen Askarinya , Larry E. Tyler
- 申请人地址： US MN Minneapolis
- 专利权人： Medtronic, Inc.
- 当前专利权人： Medtronic, Inc.
- 当前专利权人地址： US MN Minneapolis
- 代理商 Evans M. Mburu
- 主分类号： H01L23/02
- IPC分类号： H01L23/02 ; H01L23/552 ; H01L23/48
摘要：
A reconstituted wafer level package for a versatile high-voltage capable component is disclosed. The reconstituted wafer package includes a dice substantially encapsulated by a mold material except for a first face. A dielectric layer is disposed on the first face of the dice. The package further includes an array of ball bumps formed on an exterior facing portion of the dielectric layer. Further, a field plate is disposed within the dielectric material and interposed between the first face of the dice and the ball bump array. The field plate may be spaced from the dice by a predetermined distance to prevent dielectric breakdown of the material of the dielectric layer.
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