Invention Grant
- Patent Title: Atomic sensor physics package with integrated transmissive and reflective portions along light paths
- Patent Title (中): 原子传感器物理封装,沿光路集成透射和反射部分
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Application No.: US13947636Application Date: 2013-07-22
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Publication No.: US08665443B2Publication Date: 2014-03-04
- Inventor: Christina Marie Schober , James A. Vescera , Jennifer S. Strabley
- Applicant: Honeywell International Inc.
- Applicant Address: US NJ Morristown
- Assignee: Honeywell International Inc.
- Current Assignee: Honeywell International Inc.
- Current Assignee Address: US NJ Morristown
- Agency: Fogg & Powers LLC
- Main IPC: G01N21/59
- IPC: G01N21/59

Abstract:
In one embodiment, a block for a physics package of an atomic sensor is provided. The block comprises one or more sections of optically transparent material defining a vacuum sealed chamber, and including a plurality of transmissive and reflective surfaces to define a plurality of light paths intersecting the vacuum sealed chamber. The one or more sections of optically transparent material include a first monolithic section defining at least a portion of the vacuum sealed chamber. The first monolithic section includes a first portion disposed across a first light path of the plurality of light paths such that light in the first light path is incident on the first portion of the first monolithic section.
Public/Granted literature
- US20130320231A1 ATOMIC SENSOR PHYSICS PACKAGE WITH INTEGRATED TRANSMISSIVE AND REFLECTIVE PORTIONS ALONG LIGHT PATHS Public/Granted day:2013-12-05
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