Invention Grant
- Patent Title: Cover mechanism and electronic device thereof
- Patent Title (中): 盖机构及其电子设备
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Application No.: US13570258Application Date: 2012-08-09
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Publication No.: US08665585B2Publication Date: 2014-03-04
- Inventor: Ping-Yu Ko
- Applicant: Ping-Yu Ko
- Applicant Address: TW Hsichih, New Taipei
- Assignee: Wistron Corporation
- Current Assignee: Wistron Corporation
- Current Assignee Address: TW Hsichih, New Taipei
- Agent Winston Hsu; Scott Margo
- Priority: TW101105265A 20120217
- Main IPC: H05K5/00
- IPC: H05K5/00 ; H05K7/00 ; G06F1/16

Abstract:
A cover mechanism of covering a hole on a casing is disclosed in the present invention. The cover mechanism includes a base, a first holder, a second holder, a cover and a resilient component. The first holder and the second holder are respectively disposed on the base. The cover is pivotably disposed on the first holder. The resilient component includes a shaft and a curved portion. The shaft pivots to the second holder. A first end of the curved portion is connected to the shaft, and a second end of the curved portion pivots to a connecting hole on the cover. The cover drives the curved portion to generate resilient deformation when rotating from a first position to a second position, and a resilient recovering force of the curved portion can be for stopping the cover at the second position.
Public/Granted literature
- US20130215557A1 COVER MECHANISM AND ELECTRONIC DEVICE THEREOF Public/Granted day:2013-08-22
Information query