Invention Grant
US08665585B2 Cover mechanism and electronic device thereof 有权
盖机构及其电子设备

  • Patent Title: Cover mechanism and electronic device thereof
  • Patent Title (中): 盖机构及其电子设备
  • Application No.: US13570258
    Application Date: 2012-08-09
  • Publication No.: US08665585B2
    Publication Date: 2014-03-04
  • Inventor: Ping-Yu Ko
  • Applicant: Ping-Yu Ko
  • Applicant Address: TW Hsichih, New Taipei
  • Assignee: Wistron Corporation
  • Current Assignee: Wistron Corporation
  • Current Assignee Address: TW Hsichih, New Taipei
  • Agent Winston Hsu; Scott Margo
  • Priority: TW101105265A 20120217
  • Main IPC: H05K5/00
  • IPC: H05K5/00 H05K7/00 G06F1/16
Cover mechanism and electronic device thereof
Abstract:
A cover mechanism of covering a hole on a casing is disclosed in the present invention. The cover mechanism includes a base, a first holder, a second holder, a cover and a resilient component. The first holder and the second holder are respectively disposed on the base. The cover is pivotably disposed on the first holder. The resilient component includes a shaft and a curved portion. The shaft pivots to the second holder. A first end of the curved portion is connected to the shaft, and a second end of the curved portion pivots to a connecting hole on the cover. The cover drives the curved portion to generate resilient deformation when rotating from a first position to a second position, and a resilient recovering force of the curved portion can be for stopping the cover at the second position.
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