A MEMS variable optical attenuator (VOA) chip includes a frame having a planar surface, a micro-electric actuator with a movable optical shutter arranged with respect to the planar surface of the frame, where the VOA is actuated by thermal expansion. The micro-electric actuator comprises semiconductor conductors (“wires”) that can be moved, upon applying an electrical current, by thermal expansion. In one embodiment, the MEMS VOA chip is configured in a multiple wire arrangement that restricts the shutter movement in a plane.