Invention Grant
- Patent Title: Electrical assembly and socekg connector therein
- Patent Title (中): 电气组件和socekg连接器
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Application No.: US13231977Application Date: 2011-09-14
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Publication No.: US08668502B2Publication Date: 2014-03-11
- Inventor: Yen-Chih Chang , Chih-Pi Cheng
- Applicant: Yen-Chih Chang , Chih-Pi Cheng
- Applicant Address: TW New Taipei
- Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: TW New Taipei
- Agent Wei Te Chung; Ming Chieh Chang
- Priority: TW099217731A 20100914
- Main IPC: H01R12/00
- IPC: H01R12/00 ; H05K1/00
Abstract:
An electrical assembly used for connecting an IC package, includes at least an upper and a lower layer stacked with each other, wherein the upper layer is formed with an opening for receiving a socket connector. The socket connector has contacts electrically connected to conductive traces respectively provided on the upper and the lower layer.
Public/Granted literature
- US20120064742A1 ELECTRICAL ASSMEBLY AND SOCEKG CONNETOR THEREIN Public/Granted day:2012-03-15
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